Jade Hochschule The University Departments Engineering Forschung und Praxis Modelling and Simulation of Mechatronic Systems Team Members Ibrahim Zawra
Ibrahim Zawra, M.Sc.
Contact
Tel: +33624347745
✉ E-mail
Field of Research
- Multiphysics simulation using numerical dicritization techinques like(FE,FV,..etc)..
- Model order reduction for parametric and nonlinear coupled domains.
Research project
Since March 2021, Mr. Zawra has been granted from COMPAS for a research project involving the Jade University of Applied Sciences and the University of Rostock under the guidance of Prof. Dr. -Ing. Tamara Bechtold and Prof. Dr. -Ing. Dennis Hohlfeld to pursue a PhD thesis with the title: " Model Order Reduction of Parametrized and nonlinear thermo-mechanical models in microelectronics ".
Curriculum Vitae
| 03/2021-12/2023 | Phd student in Rostock University, Research Assistant , Jade University of Applied Sciences (COMPAS) |
| 03/2020-09/2020 | Internship with Siemens Digital Industries Software |
| 09 / 2018-09 / 2020 | Master of Science Computational Mechanics, Centrale Nantes |
| 12 / 2012-08 / 2018 | Different roles in the industry of offshore oil and gas, Dynamic positioning ships. (linkedIn) |
| 09 / 2006-07 / 2011 | Bachelor of Science Marine engineering and Naval architecture, Alexandria university |
Publications
Contributions to International Journals (co-author)
- C.B. Umunnakwe, I. Zawra, M. Niessner, E.B. Rudnyi, D. Hohlfeld, T. Bechtold, “Compact modelling of a thermo-mechanical finite element model of a microelectronic package”, Microelectronics Reliability, vol.151, 2023.
Conference Publications
- I. Zawra, J. Zaal, M. v. Soestbergen, T. Hauck, E. B. Rudnyi, T. Bechtold, “Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction”. In: M. van Beurden, N. V. Budko, G. Ciuprina,W. Schilders, H. Bansal, R. Barbulescu (eds), Scientific Computing in Electrical Engineering. SCEE 2022. Mathematics in Industry, vol 43, 2024, Springer, Cham.
- I. Zawra, C.B. Umunnakwe, M. van Soestbergen, E.B. Rudnyi, T. Bechtold, “Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics”, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2023, Graz, Austria.
- C.B. Umunnakwe, I. Zawra, E.B. Rudnyi, M. Niessner, T. Bechtold, “Thermo-Mechanical Super-Element of a Packaged-Chip Model for the Reintegration of Reduced State-Space Models into Finite Element Analysis Tools”, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2023, Graz, Austria.
- C.B. Umunnakwe, I. Zawra, C. Yuan, E.B. Rudnyi, D. Hohlfeld, M. Niessner, T. Bechtold, “Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for Automotive MOSFET Applications”, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2022, St Julian, Malta.